Fully Inkjet-Printed Memristors Based on Cross-Linked Poly(4-vinylphenol) Insulating Layer
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The integration of flexible electronics with Printed Electronics (PE) solutions enables cost-effective and scalable deposition of functional materials, significantly expanding possibilities in electronic applications. Among PE techniques, inkjet printing has gained substantial importance due to its ability to perform non-contact patterning with high reproducibility and rapid, high-quality deposition over both small and large areas. This fabrication method further allows real-time corrections and easy pattern modifications, enhancing the precision and adaptability of the fabrication process. Printed memristors offer several advantages, including flexibility, scalability and low power consumption. Despite being in the early stages of research, these devices have attracted significant interest [1]. However, fabrication-related defects remain a critical challenge, as they can strongly influence the resistive switching (RS) mechanisms and stability, leading to variability in device performance. In particular, the molecular structure of the organic dielectric layer plays a crucial role in determining the electrical characteristics of memristive devices [2]. In this work, fully inkjet-printed memristors utilizing cross-linked poly(4-vinylphenol) (cPVP) as an insulating polymer were fabricated and systematically analyzed to evaluate their electrical properties. The inkjet printing process used employs commercially available inks and custom-formulated materials, including Ag-based conductive inks. Figure 1 presents a schematic cross-section of the fabricated devices, an optical microscope top-view image of the printed structures, and their characteristic threshold switching behavior. A comprehensive analysis of cycle-to-cycle variability was performed to identify key factors influencing device reliability and operational stability. This study provides valuable insights into the performance and reliability of printed memristors based on organic dielectric layers.